Position Overview
Join a growing team focused on next-generation power solutions for high-performance computing and AI. As a Senior Staff Package Design Engineer, you'll lead the design and development of advanced semiconductor packages for high-density power modules. This role sits at the intersection of electrical performance, mechanical integrity, and manufacturability, requiring deep technical expertise and cross-functional coordination.
Key Responsibilities
- Lead the package design process for power modules, including the creation of 3D models and technical drawings
- Perform and interpret mechanical and thermal simulations, focusing on warpage, stress, and thermal behavior
- Document simulation outcomes and present findings to engineering and manufacturing stakeholders
- Develop test strategies and support mechanical validation of package designs
- Compare simulation models with physical test data to refine and improve accuracy
- Collaborate with manufacturing partners to transition prototypes into volume production
- Provide on-the-ground support during development cycles, troubleshooting design and process challenges
Qualifications
Candidates should demonstrate a solid foundation in materials science and direct experience with semiconductor packaging technologies. Familiarity with manufacturing processes specific to advanced packaging is essential for success in this role.
