Responsibilities
- Lead thermal design for advanced phased array antennas, ground stations, and consumer-facing wireless devices, managing all components, parts, and system interfaces
- Develop thermal solutions for semiconductor packaging, spanning conceptual design, detailed simulation, and empirical validation
- Design and execute test protocols to verify hardware performance in harsh environmental conditions
- Implement automation and streamline processes to minimize engineering effort during product development
- Apply fundamental physics-based reasoning to assess design trade-offs and component sizing
- Conduct thermal and system-level analyses to propose improvements in reliability and performance
- Generate clear, accurate documentation for design requirements, specifications, and test results
- Work closely with mechanical, electrical, software, and RF engineering teams throughout the development lifecycle
Other
- Must be available to work extended hours and weekends as needed
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
